HDI

HDI

 

Layers 36
Base material FR4, RF materials, filled and unfilled materials, TG 130 – 200
Material final thickness
starting at 0,4mm
base- or. Final copper 5µm, 9µm, 12µm, 18µm, 35µm, 70µm, others on request
Surfaces ENIG, ENEPIG, EPIG, OSP, Chem. AG, Chem. SN, HAL lead-free and remains
Gold plated connector Yes
HDI superstructures
1+N + 1, 2+N + 2, 3+N + 3, 4 + N + 4, 5+N + 5, others on request
Impedance +/- 10%, on request +/- 5%
Aspect ratio
1:18
Aspekt Ratio Blind Via 1:1
smallest mechanical drills 0,1mm
Smallest laser drill 0,075mm
Copper filled vias Yes
Vias filled with resin and capped with copper Yes
track width / -space 75µm / 75µm, others on request
 

 

Working days
Prototypes 3 – 8 + Shipping
Small series 5 – 15 + Shipping
samples from Far East starting at 10 + Shipping
Series from far East 15 – 30 + Shipping
Special production on request + Shipping
 

working hours: Monday – Friday

HDI PCB

HDI boards offer the possibility of miniaturization. Characteristic of HDI printed circuit boards are blind and / or buried vias. Often small line and space is also present.

Fig. 5