| Layers | 36 |
| Base material | FR4, RF materials, filled and unfilled materials, TG 130 – 200 |
| Material final thickness |
starting at 0,4mm |
| base- or. Final copper | 5µm, 9µm, 12µm, 18µm, 35µm, 70µm, others on request |
| Surfaces | ENIG, ENEPIG, EPIG, OSP, Chem. AG, Chem. SN, HAL lead-free and remains |
| Gold plated connector | Yes |
| HDI superstructures |
1+N + 1, 2+N + 2, 3+N + 3, 4 + N + 4, 5+N + 5, others on request |
| Impedance | +/- 10%, on request +/- 5% |
| Aspect ratio |
1:18 |
| Aspekt Ratio Blind Via | 1:1 |
| smallest mechanical drills | 0,1mm |
| Smallest laser drill | 0,075mm |
| Copper filled vias | Yes |
| Vias filled with resin and capped with copper | Yes |
| track width / -space | 75µm / 75µm, others on request |
