Layers to 4 Layers
Base material Aluminum, Copper, Glass, ceramics
Material final thickness starting at 0,3mm
Prepreg thickness >. 50µm
Thermal conductivity prepreg 0,3 W/m * k- 9 W/m * k
Copper 18µm, 35µm, 70µm, 105µm, others on request
Surfaces ENIG, OSP, HAL lead-free and leaded
soldermask color White, Black, Green, Red, others on request
Contour routed, scored, punched
Bendable aluminum
Working days
Prototypes 1 – 5 + Shipping
Small series 5 – 15 + Shipping
samples for production release from far East 2 – 10 + Shipping
Series from far East 10 – 25 + Shipping
Special production on request + Shipping
Working days: Monday – Friday


IMS circuit boards are using aluminum or copper as their basematerial (FR4), instead of FR4. They can be manufactured as a multilayer. Blind vias can be used to connect different layers or for connection to the aluminum / copper core.