| Layers | 36 |
| Base material | FR4, CEM, RF materials, filled and unfilled materials, TG 130 – 200 |
| Material final thickness | starting at 0,4mm |
| base- or. Final copper |
5µm, 9µm, 12µm, 18µm, 35µm, 70µm, 105µm, 210µm, others on request |
| Surfaces | ENIG, ENEPIG, EPIG, OSP, Chem. AG, Chem. SN, HAL lead-free and leaded |
| Gold plated connector | Yes |
| Press-fit technology | Yes |
| Blind + Buried Via |
Yes |
| Minimum drilling diameter | 0,10mm |
| Aspect ratio |
1:18 |
| soldermask color | White, Black, Green, Red, others on request |
| Contour | routed, scored, punched, laser-cut |
| Size 1 + 2 Layers | up to 1800mm x 400mm |
| Size multilayer |
1250mm x 610mm |
| track width / -space | 75µm / 75µm, others on request |
